This paper presents a set of methods to evaluate the image quality of smartphone cameras as compared with that of a DSLR camera. In recent years, smartphone cameras have been used broadly for many purposes. As the performance ...

Background: The reference dose coefficients (DCs) of the International Commission on Radiological Protection (ICRP) have been widely used to estimate organ doses of individuals for risk assessments. This approach has been ...

The low thermal conductivity of titanium alloys, Ti-6Al-4V in specific causes high temperature generation at the tool-chip interface during machining, thus making machining challenging. In view of developing a better heat ...

In the present study, the combined effects of thermal and mechanical loadings on the interlaminar shear stresses of both moderately thin and thick composite laminated beams are numerically analyzed. The finite element ...

The natural frequencies corresponding to the particular mode shapes of a large turbo-generator must not be in the resonance region before delivery. Different parameters may clearly affect these dynamic characteristics. ...

In the article by Kim et al. (2014) an author was not included in the author list. The author Ahsan-Ul-Bari Md should be included in the author list as above.

A finite element model with the consideration of damage initiation and evolution has been developed for the analysis of the dynamic response of a composite sandwich panel subject to low velocity impact. Typical damage modes ...

Korea plans to send a lunar lander following the launching of the Korea Pathfinder Lunar Orbiter (KPLO) in August 2022. The Korea Aerospace Research Institute (KARI) conducted a demand survey to select potential candidates ...

The corrosion of materials exposed to high temperature helium in a very high temperature reactor is caused by interaction with the impurities in the helium. This interaction then induces high temperature mechanical ...

Photocatalysis-assisted chemical mechanical polishing, in which the photocatalysis oxidation and silica abrasives polishing are combined, is a novel finishing technique for 4H–SiC wafer. This paper characterizes the effect ...